microactuated microelectrode devices  (Sandia National Laboratories)

Journal:

Article Title: Nonhermetic Encapsulation Materials for MEMS-Based Movable Microelectrodes for Long-Term Implantation in the Brain

doi:

Figure Lengend Snippet: (a) Micrograph of the V-beam electrothermal actuators and microelectrodes. The colored arrows show the four actuators and the microelectrode (gray—microelectrode, green—move-down actuator, blue—move-up actuator, red—release-down actuator, and brown—release-up actuator. (b) Schematic of how the actuators function in order to move the microelectrode.

Article Snippet: The microactuated microelectrode devices were fabricated using the SUMMiT-V process at Sandia National Laboratories, Albuquerque, NM.

Techniques:

Journal:

Article Title: Nonhermetic Encapsulation Materials for MEMS-Based Movable Microelectrodes for Long-Term Implantation in the Brain

doi:

Figure Lengend Snippet: Micrographs of our bio-MEMS device. (a) Clean device before implantation, with three movable microelectrodes extending off the edge of the chip. The chip is 3 mm by 6 mm, and it is wire bonded to a chip carrier with a glass-cap package. (b) Micrograph of a device that was implanted for a period of four weeks without any protective layer. Fluid entry and the debris left behind after dehydration are clearly evident, which prevented movement of the microelectrodes. (c) Schematic of the implanted device resting on the skull, with the microelectrodes extending through the craniotomy. The red arrows show fluid entry either via the craniotomy or the exudates from the skin incision surrounding the craniotomy. (d) Micrograph of a packaged device next to a U.S. penny.

Article Snippet: The microactuated microelectrode devices were fabricated using the SUMMiT-V process at Sandia National Laboratories, Albuquerque, NM.

Techniques:

Journal:

Article Title: Nonhermetic Encapsulation Materials for MEMS-Based Movable Microelectrodes for Long-Term Implantation in the Brain

doi:

Figure Lengend Snippet: Schematic illustrations of the packaged MEMS devices. (a) Packaged MEMS device with a glass-cap package and an open cavity. The chip carrier is sawed off to allow the microelectrodes to penetrate the brain. However, an open cavity is created where fluid can enter from the craniotomy opening. (b) Proposed encapsulation packaging where the mesh composite material is bonded to the open cavity, thus preventing fluid entry. (c) Micrograph of a packaged device, with the extended microelectrode penetrating through the silicone-gel-mesh composite material. The composite material encapsulates the open cavity in the chip carrier and prevents fluid entry. (d) Micrograph of the silicone-gel-mesh composite material, with the microelectrode penetrating through the silicone gel at the hole location of the mesh matrix. The scale bar is 60 μm.

Article Snippet: The microactuated microelectrode devices were fabricated using the SUMMiT-V process at Sandia National Laboratories, Albuquerque, NM.

Techniques: Encapsulation

Journal:

Article Title: Nonhermetic Encapsulation Materials for MEMS-Based Movable Microelectrodes for Long-Term Implantation in the Brain

doi:

Figure Lengend Snippet: Results of penetration-force measurement tests showing (a) the maximum force required for a 60-μm-wide silicon probe to penetrate through various composite materials and (b) the percentage of attempts that resulted in microelectrode buckling.

Article Snippet: The microactuated microelectrode devices were fabricated using the SUMMiT-V process at Sandia National Laboratories, Albuquerque, NM.

Techniques:

Journal:

Article Title: Nonhermetic Encapsulation Materials for MEMS-Based Movable Microelectrodes for Long-Term Implantation in the Brain

doi:

Figure Lengend Snippet: Micrographs of the implanted movable microelectrode devices with silicone-gel-mesh-composite-material encapsulation (14 days postimplantation). (a) Failed device with blood filling the open-cavity area. (b) Successful device with no sign of fluid entry into the open-cavity area. The scale bar is 3 mm.

Article Snippet: The microactuated microelectrode devices were fabricated using the SUMMiT-V process at Sandia National Laboratories, Albuquerque, NM.

Techniques: Encapsulation